Semiconductors
Samsung Electronics this week was awarded up to $6.4 billion from the U.S. government under the CHIPS and Science Act to build its new fab complex in Taylor, Texas. This is the third major award under the act in the last month, with all three leading-edge fabs – Intel, TSMC, and now Samsung – receiving multi-billion dollar funding packages under the domestic chip production program. Overall, the final price tag on Samsung's new fab complex is expected to reach $40 billion by the time it's completed later this decade. Samsung's CHIPS Act funding was announced during a celebratory event attended by U.S. Secretary of Commerce Gina Raimondo and Samsung Semiconductor chief executive Kye Hyun Kyung. During the event, Kyung outlined the strategic goals of...
Samsung Foundry Vows to Surpass TSMC Within Five Years
The head of Samsung's semiconductor unit acknowledged last week that the company's current mass production, leading-edge process technologies are a couple of years behind TSMC's most advanced production nodes...
18 by Anton Shilov on 5/8/2023
TSMC Announces Early Access Nodes for Next-Gen Car Chips: N4AE and N3AE
As the final set of announcements from this week's North American Technology Symposium, TSMC closed out their fab roadmap updates with some fresh news on their automotive-centric processes. For...
10 by Anton Shilov on 4/28/2023
TSMC Details 3nm Evolution: N3E On Schedule, N3P and N3X To Deliver 5% Performance Gains
Alongside some new announcements for their 2nm process node plans, TSMC has also released a progress and roadmap update for their N3 family process technologies at today's 2023 North...
13 by Anton Shilov on 4/26/2023
TSMC Outlines 2nm Plans: N2P Brings Backside Power Delivery in 2026, N2X Added To Roadmap
At its 2023 North American Technology Symposium today, TSMC has disclosed additional details about its plans for its forthcoming N2 2nm-class production nodes in 2025 – 2026 and beyond...
38 by Anton Shilov on 4/26/2023
GlobalFoundries Sues IBM Over Sharing Leading-Edge Chip IP with Intel, Rapidus
The relationship between GlobalFoundries and IBM has been rocky in recent years. Among other things, Big Blue has previously sued GF, seeking damages for abruptly stopping the development of...
10 by Anton Shilov on 4/20/2023
Synopsys Intros AI-Powered EDA Suite to Accelerate Chip Design and Cut Costs
Synopsys has introduced the industry's first full-stack AI-powered suite of electronic design automation tools that covers all stages of chip design, from architecture to design and implementation to manufacturing...
12 by Anton Shilov on 3/30/2023
NVIDIA's cuLitho to Speed Up Computational Lithography for 2nm and Beyond
Production of chips using leading-edge process technologies requires more compute power than ever. To address requirements of 2nm nodes and beyond, NVIDIA is rolling out its cuLitho software library...
31 by Anton Shilov on 3/27/2023
Gordon Moore, Intel's Co-Founder and Tech Industry Visionary, Passes Away At 94
Intel and the Gordon and Betty Moore Foundation have announced this evening that Gordon Moore, Intel’s famous co-founder and grandfather to much of the modern chip industry, has passed...
20 by Ryan Smith on 3/24/2023
Out With Organic, In With Glass? DNP Unveils Glass Core Substrate Tech For Chips
As the chip industry develops more sophisticated processors with higher heat dissipation requirements, some firms have moved on to chiplet-based designs. This not-so-gradual shift has resulted in chip packaging...
17 by Anton Shilov on 3/23/2023
Inflation Drives Up Fab Costs for Intel and Samsung by Billions of Dollars
To address future demand for semiconductors amid severe chip shortages of 2020 – 2022, all leading chipmakers announced plans to build new fabs and even disclosed their estimated costs...
15 by Anton Shilov on 3/16/2023
Samsung Seeks to Make South Korea No. 1 Chipmaker with $230B Investment Over 20 Years
Samsung on Wednesday unveiled their plan to invest $230 billion over the next 20 years in a new semiconductor production mega cluster in South Korea. The country's government believes...
22 by Anton Shilov on 3/15/2023
TSMC's 3nm Journey: Slow Ramp, Huge Investments, Big Future
Last week, TSMC issued their Q4 and full-year 2022 earnings reports for the company. Besides confirming that TSMC was closing out a very busy, very profitable year for the...
30 by Anton Shilov on 1/17/2023
TSMC Unveils Major U.S. Fab Expansion Plans: 3nm and $40 Billion by 2026
TSMC this week held its Arizona fab 'first tool-in' ceremony, where alongside celebrating its first US fab, the company also announced major expansion plans for the production facility. The...
17 by Anton Shilov on 12/7/2022
TSMC Forms 3DFabric Alliance to Accelerate Development of 2.5D & 3D Chiplet Products
Currently the majority of high-end processors are monolithic, but design methodologies are slowly but surely shifting to multi-chiplet modules as leading-edge fabrication technologies get more expensive to use. In...
9 by Anton Shilov on 10/27/2022
Micron Announces 20-Year Plan To Build $100 Billion U.S. Fab Complex
Now that the U.S. government has finally settled the matter of whether it would be providing subsidies to entice chip fabs to setup shop within the U.S., those fabs...
48 by Anton Shilov on 10/10/2022
Samsung Foundry Outlines Roadmap Through 2027: 1.4 nm Node, 3x More Capacity
Samsung outlined its foundry business roadmap for the next five years at its Foundry Forum event last week. The company plans to introduce its next generation fabrication technologies in...
14 by Anton Shilov on 10/10/2022
Micron Breaks Ground on Its $15 Billion EUV DRAM Fab in the U.S.
Micron this week broke ground on its leading-edge memory production facility near Boise, Idaho. The company will invest $15 billion in its new fab as a part of its...
23 by Anton Shilov on 9/14/2022
SK Hynix Starts Prepping for Next Semiconductor Boom with $11 Billion Memory Fab
When a major South Korean memory firm invests over $11 billion in a fab, that raises a couple of eyebrows. But when it comes within a major $100+ billion...
7 by Anton Shilov on 9/8/2022
Intel Kicks Off Fab Co-Investment Program with Brookfield: New Fabs to be Jointly Owned
Intel this week introduced its new Semiconductor Co-Investment Program (SCIP) under which it will build new manufacturing facilities in collaboration with investment partners – a sharp departure from the...
28 by Anton Shilov on 8/24/2022
Samsung's $15 Billion R&D Complex to Overcome Limits of Semiconductor Scaling
Samsung on Friday broke ground for a new semiconductor research and development complex which will design new fabrication processes for memory and logic, as well as conduct fundamental research...
26 by Anton Shilov on 8/19/2022
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