Memory
SK hynix and TSMC announced early on Friday that they had signed a memorandum of understanding to collaborate on developing the next-generation HBM4 memory and advanced packaging technology. The initiative is designed to speed up the adoption of HBM4 memory and solidify SK hynix's and TSMC's leading positions in high-bandwidth memory and advanced processor applications. The primary focus of SK hynix's and TSMC's initial efforts will be to enhance the performance of the HBM4 stack's base die, which (if we put it very simply) acts like an ultra-wide interface between memory devices and host processors. With HBM4, SK hynix plans to use one of TSMC's advanced logic process technologies to build base dies to pack additional features and I/O pins within the confines of existing...
DRAM and Motherboard Makers Demonstrate Quad-Channel DDR4-4000+ Operation
Over the course of Computex, manufacturers of memory modules and motherboards alike took to the show to showcase the latest developments in high-speed quad-channel memory configurations. Powered by Intel’s...
16 by Anton Shilov on 6/9/2017
SK Hynix Advances Graphics DRAM: GDDR6 Added to Catalogue, GDDR5 Gets Faster
SK Hynix has added GDDR6 memory chips to its product catalogue, revealing their general specifications and launch timeframe sometimes in Q4 2017. As expected, the new GDDR6 ICs will...
17 by Anton Shilov on 5/20/2017
CORSAIR Unveils Dominator Platinum Special Edition Torque 32GB DDR4 Memory Kits
Corsair has just launched a flamboyant new addition to its flagship Dominator Platinum memory series in the form of two 32GB DDR4 kits that have apparently been designed to...
17 by Patrick MacMillan on 5/16/2017
SK Hynix to Ship GDDR6 Memory for Graphics Cards by Early 2018
In a surprising move, SK Hynix has announced its first memory chips based on the yet-unpublished GDDR6 standard. The new DRAM devices for video cards have capacity of 8...
28 by Anton Shilov on 4/30/2017
G.Skill Announces 16 GB DDR4-4333 Memory Kit for Intel Kaby Lake CPUs
G.Skill on Friday announced its new top-of-the-range DDR4 memory kit for dual-channel PCs running Intel’s Kaby Lake processors. The new Trident Z kit for operates at 4333 MT/s (DDR4-4333)...
23 by Anton Shilov on 4/15/2017
G.Skill Announces Trident Z RGB DDR4 Kits with 16 GB Modules, Up to 128 GB
G.Skill has recently launched new Trident Z RGB memory kits, this time aimed at Intel X99 platforms, and following the RGB trend they give owners of high-end desktops an...
11 by Anton Shilov on 4/10/2017
JEDEC: DDR5 to Double Bandwidth Over DDR4, NVDIMM-P Specification Due Next Year
JEDEC made two important announcements about the future of DRAM and non-volatile DIMMs for servers last week. Development of both is proceeding as planned and JEDEC intends to preview...
38 by Anton Shilov on 4/3/2017
Corsair Vengeance RGB DDR4 Memory Modules with LEDs Now on Sale
Corsair last week started to sell its first Vengeance RGB memory modules, equipped with full sets of RGB LEDs that can change their colors using OS software. Right now...
19 by Anton Shilov on 3/29/2017
SK Hynix Lays Out Plans for 2017: 10nm-Class DRAM, 72-Layer 3D NAND
SK Hynix this week announced financial results for its fiscal year 2016 and also revealed general plans for 2017. As expected, the company intends to start volume production of...
12 by Anton Shilov on 1/28/2017
Toshiba Announces Plan to Sell Minority Stake In NAND Flash Production Business
This morning Toshiba has announced that they will be spinning off their chip production business as part of a broader plan to sell off a minority stake in the...
1 by Ryan Smith & Anton Shilov on 1/27/2017
Toshiba Is Studying The Possibility of Spinning Off NAND Flash Production
Toshiba on Wednesday confirmed that it is studying the possibility of splitting its NAND flash business into a separate company. While nothing has been decided as this point, the...
11 by Anton Shilov on 1/19/2017
SK Hynix Announces 8 GB LPDDR4X-4266 DRAM Packages
SK Hynix on Monday officially announced the industry’s first 8 GB LPDDR4X (LP4X) packages for next-generation mobile devices. The new memory chips not only increase DRAM performance but also...
5 by Anton Shilov on 1/11/2017
G.Skill Announces Trident Z DDR4 DIMMs for Kaby Lake CPUs
G.Skill on Wednesday introduced its new high-end DDR4 memory modules tested for compatibility with Intel’s new Core processors featuring the Kaby Lake microarchitecture. The new Trident Z modules come...
1 by Anton Shilov on 1/4/2017
SK Hynix to Build a New NAND Fab, Upgrade Existing DRAM Fab
SK Hynix on Thursday announced plans to build a new manufacturing facility to produce NAND flash memory in South Korea, and also upgrade its DRAM production plant in China...
16 by Anton Shilov on 12/23/2016
G.Skill Announces Trident Z RGB Illumination to DDR4
G.Skill this week has announced a new addition to its Trident Z family of high-performance DDR4 memory modules aimed at modders. The new Trident Z RGB will feature software-controllable...
11 by Anton Shilov on 12/21/2016
SK Hynix Updates Lineup: 8 GB LPDDR4 DRAM Packages for Mobile Devices
SK Hynix has quietly added its new 8 GB LPDDR4 package to the family of mobile DRAM offerings. The new package paves the way for single-package smartphones and tablets...
8 by Anton Shilov on 12/20/2016
Crucial Announces DDR4-2666 DIMMs for Upcoming Server Platforms
Crucial this week introduced an expansion of its server-grade modules lineup with DDR4-2666 offerings. The new DIMMs will be compatible with some of the current as well as upcoming...
5 by Anton Shilov on 12/16/2016
Micron Completes Acquisition of Inotera Memories
Micron this month completed acquisition of Inotera Memories, a DRAM production company it has co-owned for eight years controlled its output for three years. The acquisition is designed to...
1 by Anton Shilov on 12/12/2016
Transcend Introduces Extreme Temperature DDR4 SO-DIMMs
Transcend last week introduced a family of DDR4 SO-DIMMs that can operate in extreme temperature conditions. The modules are designed for industrial computers, special-purpose PCs, POS, ATM and other...
8 by Anton Shilov on 11/28/2016
Samsung Introduces 8 GB LPDDR4-4266 Package for Mobile Devices
Samsung this week announced its first LPDDR4 memory chips made using its 10nm-class DRAM fabrication technology. The new DRAM ICs feature the industry’s highest density of 16 Gb, are...
40 by Anton Shilov on 10/21/2016
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