HBM3

Micron has reaffirmed plans to start shipments of its HBM3E memory in high volume in early 2024, while also revealing that NVIDIA is one of its primary customers for the new RAM. Meanwhile, the company stressed that its new product has been received with great interest by the industry at large, hinting that NVIDIA will likely not be the only customer to end up using Micron's HBM3E. "The introduction of our HBM3E product offering has been met with strong customer interest and enthusiasm," said Sanjay Mehrotra, president and chief executive of Micron, at the company's earnings call. Introducing HBM3E, which the company also calls HBM3 Gen2, ahead of its rivals Samsung and SK Hynix is a big deal for Micron, which is an underdog on the...

SK hynix Begins Sampling HBM3e, Volume Production Planned For H1 2024

SK hynix on Monday announced that it had completed initial development of its first HBM3E memory stacks, and has begun sampling the memory to a customer. The updated ("extended"...

4 by Anton Shilov on 8/21/2023

Memory Makers on Track to Double HBM Output in 2023

TrendForce projects a remarkable 105% increase in annual bit shipments of high-bandwidth memory (HBM) this year. This boost comes in response to soaring demands from AI and high-performance computing...

9 by Anton Shilov on 8/9/2023

Micron Unveils HBM3 Gen2 Memory: 1.2 TB/sec Memory Stacks For HPC and AI Processors

Micron today is introducing its first HBM3 memory products, becoming the latest of the major memory manufacturers to start building the high bandwidth memory that's widely used in server-grade...

7 by Anton Shilov on 7/26/2023

SK Hynix Publishes First Info on HBM3E Memory: Ultra-wide HPC Memory to Reach 8 GT/s

SK Hynix was one of the key developers of the original HBM memory back in 2014, and the company certainly hopes to stay ahead of the industry with this...

5 by Anton Shilov on 5/30/2023

NVIDIA: Grace Hopper Has Entered Full Production & Announcing DGX GH200 AI Supercomputer

Teeing off an AI-heavy slate of announcements for NVIDIA, the company has confirmed that their Grace Hopper “superchip” has entered full production. The combination of a Grace CPU and...

8 by Ryan Smith on 5/29/2023

SK hynix Now Sampling 24GB HBM3 Stacks, Preparing for Mass Production

When SK hynix initially announced its HBM3 memory portfolio in late 2021, the company said it was developing both 8-Hi 16GB memory stacks as well as even more technically...

1 by Anton Shilov on 4/21/2023

As The Demand for HBM Explodes, SK Hynix is Expected to Benefit

The demand for high bandwidth memory is set to explode in the coming quarters and years due to the broader adoption of artificial intelligence in general and generative AI...

9 by Anton Shilov on 4/18/2023

NVIDIA Announces H100 NVL - Max Memory Server Card for Large Language Models

While this year’s Spring GTC event doesn’t feature any new GPUs or GPU architectures from NVIDIA, the company is still in the process of rolling out new products based...

25 by Ryan Smith on 3/21/2023

NVIDIA Hopper GPU Architecture and H100 Accelerator Announced: Working Smarter and Harder

Depending on your point of view, the last two years have either gone by very slowly, or very quickly. While the COVID pandemic never seemed to end – and...

88 by Ryan Smith on 3/22/2022

SK Hynix Announces Its First HBM3 Memory: 24GB Stacks, Clocked at up to 6.4Gbps

Though the formal specification has yet to be ratified by JEDEC, the memory industry as a whole is already gearing up for the upcoming launch of the next generation...

19 by Ryan Smith on 10/20/2021

Hot Chips 2021 Live Blog: New Tech (Infineon, EdgeQ, Samsung)

Welcome to Hot Chips! This is the annual conference all about the latest, greatest, and upcoming big silicon that gets us all excited. Stay tuned during Monday and Tuesday...

3 by Dr. Ian Cutress on 8/23/2021

SK Hynix Licenses DBI Ultra Interconnect for Next-Gen 3DS and HBM DRAM

SK Hynix has inked a new broad patent and technology licensing agreement with Xperi Corp. Among other things, the company licensed the DBI Ultra 2.5D/3D interconnect technology developed by...

9 by Anton Shilov on 2/11/2020

Samsung Starts Production of 8 Gb DDR4-3600 ICs Using 2nd Gen 10nm-Class Tech

Samsung late on Wednesday said that it had initiated mass production of DDR4 memory chips using its second generation '10 nm-class' fabrication process. The new manufacturing technology shrinks die...

24 by Anton Shilov on 12/20/2017

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